Ultra high capacity optical interconnects using photonic nano-technology
Wednesday, January 31, 2018Funded PhD Project (Students Worldwide)
Within the PASSION project the PhD student is required to further develop our assembly process. In particular we wish to address the following topics:
1. Scaling the stacking technology to devices that operate at higher bit-rate and have larger size (e.g 16 Tbps)
2. Supporting co integration of VCSELs with adjacent planar optical integration technologies.
3. Introducing new schemes of integration for improved signal integrity
4. Development of machine manufacturable packaging technologies for three and 2.5 dimensional devices.
The work will include both process-development in a cleanroom environment as well as practical development of packaging solutions in an industrial context. We wish to get in contact with candidates that have strong technical background. Since strong interaction with our industrial partners is required strong communication skills are also essential. Candidates for the PhD position should have a Master’s degree in Electrical Engineering, with excellent grades.
project is already funded and is scheduled to start in the coming months.